Chiplets: Powering the Next Generation of AI Systems

  Chiplets: Powering the Next Generation of AI Systems



Key Takeaways

  • $411B Market by 2035 — Chiplets enable modular SoC designs, dividing large monolithic chips into smaller, reusable dies.

  • Interconnect is Everything — UCIe (Universal Chiplet Interconnect Express) is emerging as the die-to-die connectivity standard.

  • Packaging Drives Innovation — 2.5D and 3D integration require early co-design to address thermal, mechanical, and power-integrity challenges.

  • Collaboration is Key — Synopsys and Arm are leading the way to make AI chiplet design more interoperable, reliable, and secure.

Why Chiplets Matter

AI workloads have outgrown traditional SoC scaling. As monolithic dies approach reticle limits, yields drop and costs rise—while analog and I/O circuits gain little benefit from advanced nodes.

To sustain performance growth, the industry is turning to chiplets—modular, scalable building blocks that redefine high-performance system design.

Chiplets allow heterogeneous integration of compute, memory, and I/O dies within a System-in-Package (SiP), offering flexibility and cost efficiency.

 According to IDTechEx, the chiplet market is projected to reach $411 billion by 2035.

 System Partitioning & Process Node Choices

The first step in chiplet design is deciding how to partition system functions:

  • Compute dies → advanced process nodes for performance

  • Memory & I/O dies → mature nodes for cost efficiency

Performance requirements determine whether designers use 2.5D interposers or 3D stacking (as in AMD’s Ryzen 7000X3D, where compute and cache are vertically integrated for ultra-low latency).

 Designing Die-to-Die Connectivity

Interconnect performance defines chiplet success.

  • UCIe has become the preferred standard, supporting both cost-optimized substrates and high-density interposers.

  • Designers balance data rates (16G–64G), lane counts, and bump pitches to optimize bandwidth and power.

  • Integration with on-chip protocols like AXI, Arm CXS, and PXS ensures maximum throughput.

 Example: AI I/O chiplets demand ultra-low latency and high bandwidth to communicate efficiently with compute dies.

 Advanced Packaging & Integration

Packaging is now central to semiconductor innovation.

Type

Example

Bump Pitch

Benefits

Organic Substrate

Low-cost

110–150 μm

Economical for moderate interconnects

Silicon Interposer (2.5D)

High-density

25–55 μm

Excellent bandwidth and density

3D Stacking

Vertical integration

<25 μm

Ultimate performance, but complex

Emerging RDL interposers offer a balanced option—supporting large system integration at lower cost.

Designers must also consider:

  • Thermal management

  • Mechanical reliability

  • Power integrity

  • Testability (IEEE 1838, KGD verification)

Securing & Verifying Multi-Die Designs

As systems become more modular, the attack surface widens.

  • Each chiplet must be authenticated via attestation or secure boot.

  • Root of Trust architectures manage encryption and isolate sensitive workloads.

  • Data in motion is protected via PCIe/CXL IDE, DDR IME, or Ethernet MACsec.

Verification includes system-level simulation, emulation, and virtual prototyping, enabling early software bring-up and faster time-to-market.

Synopsys & Arm: Simplifying AI Chip Design

At Chiplet Summit 2025, Synopsys VP Abhijeet Chakraborty and Arm VP Eddie Ramirez showcased joint efforts to accelerate AI and multi-die development.

Highlights:

  • Arm Total Design integrates pre-validated Neoverse Compute Subsystems (CSS) with Synopsys IP.

  • Fusion Compiler and Virtualizer tools streamline design flows and early validation.

“We’re barely scratching the surface,” said Chakraborty. “Interoperability, reliability, and security will define the future of chiplet ecosystems.”

The Road Ahead

The shift from monolithic to modular design is transforming semiconductor development.

Future progress depends on:

  • Collaboration between ecosystem partners

  • Standardization of interconnects and design flows

  • Shared innovation to accelerate adoption

With companies like Synopsys advancing verified IP subsystems, UCIe standards, and co-design tools, the journey from concept to production is faster and more predictable.

Final Thought

The next generation of AI systems won’t rely on bigger chips — they’ll be built from smarter, interconnected chiplets, delivering scalable performance, efficiency, and flexibility for the compute-hungry workloads of tomorrow.


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